The IRFP260NPBF is an N-channel Power MOSFET manufactured by Infineon Technologies, designed for high power applications. Here are the specifications for this component:
- Manufacturer: Infineon Technologies
- Part Number: IRFP260NPBF
- Type: MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor)
- Channel Type: N-Channel (N-CH)
- Voltage Rating: 200V (indicating its maximum rated voltage)
- Current Rating: 50A (indicating its maximum continuous drain current)
- Package: TO-247AC (Through Hole, 3-pin package with a central tab)
The IRFP260NPBF is designed for high-power applications and is commonly used in power supplies, motor control, and other applications where high current-handling capability is required. The TO-247AC package is known for its ability to efficiently dissipate heat and is ideal for applications where heat dissipation is a concern due to its large metallic tab that can be connected to a heatsink for effective thermal management.
| DataSheet | IRFP260NPBF PDF |
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IRFP260NPBF: Purpose, characteristics, heat dissipation
The IRFP260NPBF is an N-channel Power MOSFET designed and manufactured by Infineon Technologies. Let's delve into its purpose, characteristics, and heat dissipation capabilities.
Purpose: The IRFP260NPBF MOSFET is designed to be used as a switch in a variety of electronic applications, especially those requiring high power and voltage levels. Common applications include power supplies, motor control, inverters, and various power electronics where high current and voltage capacity are essential.
Characteristics:
- MOSFET Type: N-channel
- Voltage Rating: 200V (indicating its maximum rated voltage)
- Current Rating: 50A (indicating its maximum continuous drain current)
- Package: TO-247AC (Through Hole, 3-pin package with a central tab)
This MOSFET's high voltage and current ratings make it suitable for high-power applications, delivering efficient switching with low on-state resistance.
Heat Dissipation: Effective heat dissipation is crucial for power MOSFETs, especially those intended for high-power applications. The TO-247AC package, characterized by its central metallic tab, allows for efficient heat dissipation. This tab can be connected to a heatsink, transferring heat away from the MOSFET to ensure that it operates within its specified temperature range.
To ensure optimal performance and reliability, especially in high-power applications, proper thermal management including the use of a suitable heatsink, thermal interface material, and adequate PCB layout for heat dissipation is essential. By implementing these heat dissipation measures, the MOSFET can operate within safe temperature limits, maximizing its performance and lifespan.
