558-10-360M19-001104

558-10-360M19-001104

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Manufacturer Part 558-10-360M19-001104
Manufacturer Preci-Dip
Description BGA SURFACE MOUNT 1.27MM
Category Connectors, Interconnects
Family Sockets for ICs, Transistors
Lifecycle: New from this manufacturer.
Delivery: DHL FedEx Ups TNT EMS
Payment T/T Paypal Visa MoneyGram Western Union
DataSheet 558-10-360M19-001104 PDF

Availability

InStock 1,161,110
UnitPrice $ 36.38934

558-10-360M19-001104 Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team rfq@www.zhschip.com

558-10-360M19-001104 Specifications

Type Description
Series:558
Package:Bulk
Part Status:Active
Type:BGA
Number of Positions or Pins (Grid):360 (19 x 19)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Surface Mount
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

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