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| Manufacturer Part | MTV1-5PAL57 |
|---|---|
| Manufacturer | VEAM |
| Description | MICRO |
| Category | Connectors, Interconnects |
| Family | Rectangular Connectors - Headers, Male Pins |
| Lifecycle: | New from this manufacturer. |
| Delivery: | DHL FedEx Ups TNT EMS |
| Payment | T/T Paypal Visa MoneyGram Western Union |
| DataSheet | MTV1-5PAL57 PDF |
| InStock | 885,267 |
|---|---|
| UnitPrice | $ 42.00514 |
MTV1-5PAL57 Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team rfq@www.zhschip.com
| Type | Description |
|---|---|
| Series: | MTV |
| Package: | Bulk |
| Part Status: | Active |
| Connector Type: | Plug |
| Contact Type: | Male Pin |
| Pitch - Mating: | 0.050" (1.27mm) |
| Number of Positions: | 5 |
| Number of Rows: | 1 |
| Row Spacing - Mating: | - |
| Number of Positions Loaded: | All |
| Style: | Board to Board |
| Shrouding: | Unshrouded |
| Mounting Type: | Through Hole, Right Angle |
| Termination: | Solder |
| Fastening Type: | Push-Pull |
| Contact Length - Mating: | - |
| Contact Length - Post: | 0.190" (4.83mm) |
| Overall Contact Length: | - |
| Insulation Height: | 0.070" (1.78mm) |
| Contact Shape: | Circular |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 5.00µin (0.127µm) |
| Contact Finish - Post: | - |
| Contact Material: | Copper Alloy |
| Insulation Material: | Polyester, Glass Filled |
| Features: | - |
| Operating Temperature: | -55°C ~ 125°C |
| Ingress Protection: | - |
| Material Flammability Rating: | - |
| Insulation Color: | Black |
| Current Rating (Amps): | 3A |
| Voltage Rating: | - |
We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.
We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.
TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.
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